The relationship between Apple's products and lasers is too close. Let's count the laser elements on Apple's new products.
Laser Screen Cutting
The iPhone XS/XR/XS Max has a full screen design. For the full screen profile cutting, the current best processing solution is laser cutting. It is non-contact processing, has no mechanical stress damage, and is highly efficient. The laser is focused on the material, the material is locally heated until the melting point is exceeded, and then the molten material is blown away by the high pressure gas. As the beam and the material move, a slit having a very narrow width can be formed with higher precision and more energy. Goodly meet the needs of full screen mobile phone manufacturing.
Laser Body Marking
The logo, backboard text, and battery parts of the iPhone use laser marking technology. It is a marking method that uses a high-energy-density laser to locally irradiate the workpiece to vaporize the surface material or cause a color change, thereby leaving a permanent marking, which has the characteristics of high precision, high speed, clear marking, etc. . The mobile phone uses laser marking, which is a permanent marking method, which can improve the anti-counterfeiting ability and increase the added value, so that the product looks higher grade and more brand-like.
Laser Body Drilling
There are many small holes such as speakers and microphones on the iPhone. The laser technology has the features of maintenance-free, easy operation, non-contact processing and no consumables, which saves the production cost and makes the drilling hole smaller and does not require subsequent processing.
Laser PCB, FPC Board Processing
Laser technology on PCB and FPC boards is mainly reflected in marking and drilling and cutting. Compared with PCB coding, PCB marking has the advantages of finer, more efficient, clearer and lower cost. It is of great significance in quality information control and SMT production line. Laser drilling and laser cutting of PCB and FPC boards have the advantages of higher precision and faster speed, and laser drilling can also achieve blind holes, which cannot be achieved by traditional processes.
