Info@sino-galvo.com    +86-13052926556
Cont

Have any Questions?

+86-13052926556

Sep 02, 2022

Laser Galvanometer Marking Method

The structure of galvanometer laser marking is mainly composed of laser, high-speed galvanometer system, computer control system and other parts. Use the computer system can control the galvanometer system to scan along the X&Y axis to mark numbers, text graphics, etc. on a certain surface. There are two forms of focusing: one is to focus first and then irradiate the workpiece through the galvanometer system, as shown in Figure (a);

galvo scanner

The other is that the light beam first passes through the galvanometer system and then the focusing mirror hits the workpiece, as shown in the figure (b).

galvanometer scanner

This method can be marked on the area of 50x50 mm or 100x100 mm, the marked area can be adjusted at will, and various complex characters, patterns and images can be marked.

Sino-Galvo's UV7210-3D-200 dynamic focusing galvanometer system adopts advanced optical design scheme and Z-axis system with linear drive. It has independent intellectual property rights and integrates data acquisition, data processing, electronic control, mechanical follow-up, and optical imaging, optical compensation, optical scanning and other functions. The system adopts an integral structure, with small size and good sealing, ensuring the stability under long-term working conditions.

The control software adopts advanced point-by-point tracking dynamic light spot compensation algorithm, and the embedded marking control board can realize offline work, which is convenient for batch processing.

The focusing spot of 355 nm ultraviolet light is very small, and the effect of marking is to directly break the molecular chain of the material through the short-wavelength laser. It is mainly used for ultra-fine marking, so it greatly reduces the mechanical deformation and thermal deformation (belonging to cold light) of materials. Engraving is especially suitable for applications such as food, pharmaceutical packaging material marking, micro-hole drilling, high-speed division of glass materials and complex pattern cutting of silicon wafers.

Send Inquiry